SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

A semiconductor device including a first lower buffer chip, an upper buffer chip disposed on an upper surface of the first lower buffer chip, a plurality of conductive posts spaced apart from the first lower buffer chip and disposed on a lower surface of the upper buffer chip, and a first memory chi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jang, Yeonho, Kim, Joonsung, Song, Inhyung, Kim, Dongkyu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device including a first lower buffer chip, an upper buffer chip disposed on an upper surface of the first lower buffer chip, a plurality of conductive posts spaced apart from the first lower buffer chip and disposed on a lower surface of the upper buffer chip, and a first memory chip stack structure disposed on the upper buffer chip and including a plurality of first memory chips.