MULTILAYER ELECTRONIC SUBSTRATE

There is provided a multilayer electronic substrate that is reduced in size and thickness while reducing stress applied to a connector. The multilayer electronic substrate includes: a first substrate; a second substrate placed on the first substrate such that surfaces of the first and second substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRANO, KEIICHI, SHIROTA, KANAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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