MULTILAYER SUBSTRATE

In a multilayer substrate, first interlayer connection conductors pass through resin layers in a lamination direction and electrically connect first and second signal conductors. Second interlayer connection conductors pass through the resin layers in the lamination direction and electrically connec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TERANISHI, Keisuke, FUJII, Hirotaka
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In a multilayer substrate, first interlayer connection conductors pass through resin layers in a lamination direction and electrically connect first and second signal conductors. Second interlayer connection conductors pass through the resin layers in the lamination direction and electrically connect the first and second signal conductors. The first interlayer connection conductors are aligned in a first row extending along the first signal conductor when viewed in the lamination direction. The second interlayer connection conductors are aligned in a second row extending along the first signal conductor when viewed in the lamination direction. A direction perpendicular to the direction in which the first signal conductor extends, when viewed in the lamination direction, is a line width direction. A position of the second row in the line width direction is different from a position of the first row in the line width direction.