HYBRID BONDING BASED INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

HYBRID BONDING BASED INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

The present disclosure relates to a hybrid bonding based integrated circuit (HBIC) device and its manufacturing method. In some embodiments, an exemplary HBIC device includes: a first die stack comprising one or more dies; and a second die stack integrated above the first die stack. The second die s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUAN, Tianchan, ZHENG, Hongzhong, NIU, Dimin, LI, Shuangchen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure relates to a hybrid bonding based integrated circuit (HBIC) device and its manufacturing method. In some embodiments, an exemplary HBIC device includes: a first die stack comprising one or more dies; and a second die stack integrated above the first die stack. The second die stack includes at least two memory dies communicatively connected to the first die stack by wire bonding.