FLIP CHIP SEMICONDUCTOR PACKAGES

FLIP CHIP SEMICONDUCTOR PACKAGES

A flip chip semiconductor package includes a wiring substrate that includes a core layer and a lower protection layer on a lower surface of the core layer, a trench group that includes a plurality of trenches spaced apart from one another on the lower protection layer, a flip chip on the wiring subs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Lee, Kyunglyul
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A flip chip semiconductor package includes a wiring substrate that includes a core layer and a lower protection layer on a lower surface of the core layer, a trench group that includes a plurality of trenches spaced apart from one another on the lower protection layer, a flip chip on the wiring substrate and the trench group, and a molding layer that is on the flip chip and the wiring substrate, and extends into the plurality of trenches.