SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

A semiconductor device includes: a first lead having a die pad; a second lead arranged to be spaced apart from the first lead; a first semiconductor element mounted on the die pad; and a plurality of wires electrically connected to the first semiconductor element and the second lead, wherein the die...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SHIRAI, Katsutoki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device includes: a first lead having a die pad; a second lead arranged to be spaced apart from the first lead; a first semiconductor element mounted on the die pad; and a plurality of wires electrically connected to the first semiconductor element and the second lead, wherein the die pad and the second lead are arranged side by side in a first direction perpendicular to a thickness direction, and wherein all of the plurality of wires are inclined with respect to the first direction when viewed in the thickness direction.