THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES

Microelectronic devices, assemblies, and systems include a multichip composite device having one or more chiplets bonded to a base die and an inorganic dielectric material adjacent the chiplets and over the base die. The multichip composite device is coupled to a structural member that is made of or...

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Bibliographische Detailangaben
Hauptverfasser: Liff, Shawna, Swan, Johanna, Tomita, Yoshihiro, Brun, Xavier, Li, Wenhao, Kabir, Mohammad Enamul, Mongia, Rajiv, Elsherbini, Adel, Krishnatreya, Bhaskar Jyoti, Niazi, Haris Khan, Sounart, Thomas, Eid, Feras, Kellar, Scot, Seangatith, Jiraporn, Mallik, Debendra, Valavala, Krishna Vasanth, Jun, Kimin, Jiang, Lei
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Microelectronic devices, assemblies, and systems include a multichip composite device having one or more chiplets bonded to a base die and an inorganic dielectric material adjacent the chiplets and over the base die. The multichip composite device is coupled to a structural member that is made of or includes a heat conducting material, or has integrated fluidic cooling channels to conduct heat from the chiplets and the base die.