MODIFIED RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF

The present disclosure provides a modified resin composition, a preparation method and use thereof. The raw materials of the modified resin composition includes: 65 to 100 parts by mass of a matrix resin, 10 to 40 parts by mass of a phenoxy resin, 0.5 to 25 parts by mass of nano silicon dioxide, 2 t...

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Bibliographische Detailangaben
Hauptverfasser:	FUSE, KEMMEI, HUANG, Rongnuan, QI, Xiaolong, ZHANG, Xinquan
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure provides a modified resin composition, a preparation method and use thereof. The raw materials of the modified resin composition includes: 65 to 100 parts by mass of a matrix resin, 10 to 40 parts by mass of a phenoxy resin, 0.5 to 25 parts by mass of nano silicon dioxide, 2 to 15 parts by mass of a curing agent, 0 to 2 parts by mass of a curing accelerator, and 0 to 1 part by mass of a coupling agent. The modified resin composition has excellent toughness, excellent processability during mechanical punching process, a relatively low powder loss rate, and excellent bonding performance and heat resistance.