CIRCUIT ASSEMBLY

Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating componen...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIMODA, Hiroki, YANAGIDA, Taiji
Format: Patent
Sprache:eng
Schlagworte:
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