CIRCUIT ASSEMBLY

Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating componen...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIMODA, Hiroki, YANAGIDA, Taiji
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target; a case accommodating the heat-generating components and the metal plates, and having opening portions that expose the heat-dissipating portions of the metal plates to an outside; and an insulating film sealing the opening portions of the case and fixed to the case.