BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME

BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME

A bonded structure for debugging integrated circuit devices and a method for debugging integrated circuit devices is disclosed. The bonded structure may comprise a debugging element and an integrated circuit device. The debugging element may comprise a debugging circuitry. The debugging element may...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Workman, Thomas, Haba, Belgacem
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:A bonded structure for debugging integrated circuit devices and a method for debugging integrated circuit devices is disclosed. The bonded structure may comprise a debugging element and an integrated circuit device. The debugging element may comprise a debugging circuitry. The debugging element may be bonded to an integrated circuit device. The debugging element may be configured to debug the integrated circuit device.