ON BOARD POWER DEVICE AND THERMAL MANAGEMENT SYSTEM

The present disclosure discloses an onboard power device and a thermal management system, wherein the thermal management system comprises the onboard power device which comprises a power assembly comprising a plurality of electronic components and a shell comprising an inner cavity and a coolant pas...

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Bibliographische Detailangaben
Hauptverfasser:	YOU, Peiai, ZHANG, Jinfa, DING, Hongguang, MENG, Yueyong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
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Beschreibung
Zusammenfassung:	The present disclosure discloses an onboard power device and a thermal management system, wherein the thermal management system comprises the onboard power device which comprises a power assembly comprising a plurality of electronic components and a shell comprising an inner cavity and a coolant passage that are isolated from each other, wherein the power assembly is disposed in the inner cavity which is filled with insulating heat conductive fluid, the power assembly being immersed in the insulating heat conductive fluid, and wherein a coolant flows through the coolant passage. The present disclosure allows the power assembly to be sufficiently and uniformly cooled by immersing in insulating heat conductive fluid, and by circulating coolant in the coolant passage of the onboard power device.