SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bond...

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Bibliographische Detailangaben
Hauptverfasser:	SAKAI, Norikazu, YOKOYAMA, Yoshinori, SATO, Yuji, NAKATA, Yosuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.