SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON EMITTER ARRAY CHIPS

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON EMITTER ARRAY CHIPS

A method for fabricating silicon die stacks for electron emitter chips by applying sintering to bind a silicon substrate die to other die layers. Metal powder is applied to the bonding surface of the die, covered with the chip carrier or chip and compressed between two heated plates. The bonding pad...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG, Ghiyuun, JEONG, Ukyo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for fabricating silicon die stacks for electron emitter chips by applying sintering to bind a silicon substrate die to other die layers. Metal powder is applied to the bonding surface of the die, covered with the chip carrier or chip and compressed between two heated plates. The bonding pads of the die may be conductively coupled to corresponding bonding pads of the other die layers.