FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

A fan-out packaging structure and a method for manufacturing the same are provided. The structure comprises: a fan-out substrate unit, and a secondary fan-out unit; an effective electrical connection between a second top surface of the fan-out substrate unit and a third bottom surface of the secondary fan-out unit is formed through a second solder array, and the fan-out substrate unit comprises a first wiring layer and a second wiring layer connected by conductive posts. By having a fan-out substrate unit with a double-layer wiring layer as the substrate of the fan-out wiring layer, the present disclosure reduces the achievable minimum line width, thereby increasing the achievable line density of the fan-out package. Meanwhile, replacing the traditional substrate with the double-layer wiring layer, and preparing the fan-out substrate unit and the secondary fan-out unit separately and then combining the two, shortens the time required to prepare the whole structure.