SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

An object is to provide a technique capable of reducing stress in the entire semiconductor device. The semiconductor device includes a plurality of sub-modules including a first sealing member, an insulating substrate provided with a first circuit pattern electrically connected to at least one of the conductive plates of the plurality of sub-modules, connection members electrically connected to at least one of the conductive pieces of the plurality of sub-modules, and a second sealing member having lower hardness than the first sealing member, which seals the plurality of sub-modules, the insulating substrate, and the connection members.