SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

According to the present disclosure, there is provided a technique capable of improving a throughput and suppressing an oxidation of a surface of a substrate and an adhesion of particles to the surface of the substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a plurality of process chambers; a transfer chamber provided adjacent to the plurality of process chambers and maintained in a decompressed state; a waiting chamber capable of communicating with the transfer chamber in the decompressed state, provided with a plurality of supports capable of supporting a plurality of substrates after a process set for a first process chamber among the plurality of process chambers is completed, and configured such that an inert gas is supplied for every predetermined number of substrates among the plurality of substrates respectively supported by the plurality of supports.