IMPRINTING METHOD, IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD

The throughput is improved by changing a timing of beginning aligning between a mold and a substrate depending on an area in a pattern-forming region where a pattern can be formed. An imprinting method for forming a pattern of an imprint material in a plurality of pattern-forming regions on a substr...

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1. Verfasser:	SAKATA, YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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creator	SAKATA, YUJI
description	The throughput is improved by changing a timing of beginning aligning between a mold and a substrate depending on an area in a pattern-forming region where a pattern can be formed. An imprinting method for forming a pattern of an imprint material in a plurality of pattern-forming regions on a substrate using a mold having a pattern portion, having contacting the mold and the imprint material and relatively aligning the mold and the pattern-forming region based on a positional relationship between the mold and an alignment mark of each pattern-forming region, in which, in the aligning, a timing of beginning the aligning is earlier relative to the contacting if an area in the plurality of pattern-forming regions where a pattern can be formed is a second area that is wider than a first area than if an area is the first area.
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subjects	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
title	IMPRINTING METHOD, IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD
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