HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR

HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR

A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cho, Su Hyeon, Lee, Seung Hyup, Nam, Min Ho, Yun, Gyeong Ho, Kim, Yun Jin
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Beschreibung
Zusammenfassung:A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part and a heat absorption part.