METHODS OF BONDING COPPER AND ARTICLES FORMED THEREBY

METHODS OF BONDING COPPER AND ARTICLES FORMED THEREBY

Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two subs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Kryger, Matthew J
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two substrates. Structural adhesives including such adhesion promoters and methods for bonding two substrates are also disclosed herein.