RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAMURA, Tatsuro, MIYAHIRA, Tetsuro, ITO, Sayaka, OGASHIWA, Takaaki
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 μm, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.