SYSTEM FOR THERMAL TREATMENT OF AN ELECTRICAL AND/OR ELECTRONIC COMPONENT

The present invention relates to a system (100) for thermal treatment of at least one electrical and/or electronic component, comprising at least one housing (110) that accommodates at least one heat exchanger (130), the electrical and/or electronic component (120) being suitable for being accommoda...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	De Vaulx, Cédric, Bravo, Yolanda, Blandin, Jeremy, Leblay, Patrick, Azzouz, Kamel, Tissot, Julien
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a system (100) for thermal treatment of at least one electrical and/or electronic component, comprising at least one housing (110) that accommodates at least one heat exchanger (130), the electrical and/or electronic component (120) being suitable for being accommodated in the housing and for resting on the at least one heat exchanger (130), the heat exchanger (130) comprising at least one network of microfibres (150), the microfibres (151) being suitable for having a refrigerant fluid flowing through them and the heat exchanger (130) being suitable for being in contact with at least two adjacent faces (121, 122) of the electrical and/or electronic component (120).