RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Deterioration of characteristics is reduced. A radio-frequency module includes a first power amplifier circuit, a second power amplifier circuit, and a substrate. The first power amplifier circuit includes a first amplifier component and a first transformer. The second power amplifier circuit includes a second amplifier component and a second transformer. The radio-frequency module further includes a long bump disposed on one main surface of the substrate. The first amplifier component is disposed on the one main surface of the substrate with the long bump interposed between the first amplifier component and the one main surface of the substrate. The long bump is located between the first transformer and the second transformer when viewed in plan in a thickness direction of the substrate.