DEPOSITION APPARATUS AND DRIVING METHOD THEREOF

A deposition apparatus includes a plate; electrostatic chucks including a first surface on which the plate is disposed; and a second surface on which a substrate is supported; and a control device that controls a flatness between the electrostatic chucks, and each of the electrostatic chucks include...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, Min Goo, RYU, Suk Ha, SONG, Min Chul, CHO, Young Sun, KIM, Min Seok, KO, Jun Hyeuk, KIM, Eui Gyu
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus includes a plate; electrostatic chucks including a first surface on which the plate is disposed; and a second surface on which a substrate is supported; and a control device that controls a flatness between the electrostatic chucks, and each of the electrostatic chucks includes driving shafts disposed through an area of an edge of the first surface of each of the electrostatic chucks, and the control device controls the flatness between the electrostatic chucks through the driving shafts by measuring a height deviation between the electrostatic chucks.