INTEGRATED CIRCUIT PACKAGE

An integrated circuit package includes a cavity within which a circuit device is contained. At least one through hole is provided in at least one wall of the cavity. The at least one through hole includes at least one first portion flaring towards the cavity with a frustoconical shape, for example.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LAPORTE, Fanny, AUCHERE, David
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An integrated circuit package includes a cavity within which a circuit device is contained. At least one through hole is provided in at least one wall of the cavity. The at least one through hole includes at least one first portion flaring towards the cavity with a frustoconical shape, for example.