SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF

SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF

A substrate supporting apparatus includes a heating plate, a radio frequency (RF) electrode in the heating plate, and an RF delivery structure in contact with a bottom surface of the RF electrode. The heating plate includes a first insertion hole, which is recessed into the heating plate from a bott...

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Bibliographische Detailangaben
Hauptverfasser: JEON, ILJUN, KIM, JAEHYUN, LEE, JONGHYUN, KIM, KIYONG, KIM, YOUNGKWON, YANG, YOODONG, KIM, HYUNGJOON, JEONG, HEE JONG, YOO, MINSUCK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:A substrate supporting apparatus includes a heating plate, a radio frequency (RF) electrode in the heating plate, and an RF delivery structure in contact with a bottom surface of the RF electrode. The heating plate includes a first insertion hole, which is recessed into the heating plate from a bottom surface of the heating plate to expose the bottom surface of the RF electrode. The RF delivery structure includes an RF rod, a portion of which is inserted in the first insertion hole, and through which an RF power is supplied to the RF electrode. The RF rod includes a first material, and a relative permeability of the first material is less than 100, a volume resistivity of the first material is smaller than 70 nΩm, and a melting point of the first material is higher than 1400° C.