SPUTTERING TARGET AND METHOD OF MANUFACTURING THE SAME

A sputtering target according to an aspect of the present invention may comprise a substrate; and an alloy target layer, disposed on the substrate, having an amorphous phase at a ratio of 98.0% or higher.

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, Yoo Kyung, KIM, Choongnyun Paul, HAM, Gi Su
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A sputtering target according to an aspect of the present invention may comprise a substrate; and an alloy target layer, disposed on the substrate, having an amorphous phase at a ratio of 98.0% or higher.