POLYIMIDE-BASED RESIN FILM, SUBSTRATE FOR DISPLAY DEVICE, AND OPTICAL DEVICE USING THE SAME

The present disclosure relates to a polyimide-based resin film wherein a thermal hysteresis gap at a temperature of 50° C. or more and 150° C. or less is 100 μm or more and 500 μm or less, and a substrate for display device, and an optical device using the same.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HONG, Ye Ji, KANG, Mi Eun
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure relates to a polyimide-based resin film wherein a thermal hysteresis gap at a temperature of 50° C. or more and 150° C. or less is 100 μm or more and 500 μm or less, and a substrate for display device, and an optical device using the same.