SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS
A method of manufacturing an electronic device includes providing a work piece comprising a first material, a first side, a second side opposite to the first side, and a first CTE. The method includes providing recesses extending into the work piece from the first side and comprising a pattern. The...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method of manufacturing an electronic device includes providing a work piece comprising a first material, a first side, a second side opposite to the first side, and a first CTE. The method includes providing recesses extending into the work piece from the first side and comprising a pattern. The method includes providing a second material comprising a second CTE within the recesses and over the first material between the recesses. The method includes providing a third material comprising a third CTE over one of the second side or the second material. The third CTE and the second CTE are different than the first CTE. |
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