BALL GRID ARRAY PACKAGE DESIGN

An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: He, Qinghong, Wang, Isaac Q
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on the first surface of the substrate. The integrated circuit device is bonded to a first surface of the PCB via the BGA. The die is collocated with the cutout area.