3D SEMICONDUCTOR PACKAGE

3D SEMICONDUCTOR PACKAGE

A 3D semiconductor package provided herein includes a package substrate; a semiconductor package bonded to the package substrate; a heat dissipation unit attached to the semiconductor package, wherein the heat dissipation unit comprises a first heat dissipation component and a second heat dissipatio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Chen, Tsung-Yu, Hung, Wensen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A 3D semiconductor package provided herein includes a package substrate; a semiconductor package bonded to the package substrate; a heat dissipation unit attached to the semiconductor package, wherein the heat dissipation unit comprises a first heat dissipation component and a second heat dissipation component attached to the first heat dissipation component; and a first interface material disposed between the first heat dissipation component and the second heat dissipation component, wherein the first interface material is a phase change material.