CIRCUIT BOARD ASSEMBLY WITH INTEGRATED AIRFLOW PATH

CIRCUIT BOARD ASSEMBLY WITH INTEGRATED AIRFLOW PATH

A circuit board assembly may include an integrated airflow path formed with a partially closed volume to direct airflow received at a first opening of the integrated airflow path through the integrated airflow path and to a second opening of the integrated airflow path, a circuit board mechanically...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CURTIS, Robert B, TUNKS, Eric
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A circuit board assembly may include an integrated airflow path formed with a partially closed volume to direct airflow received at a first opening of the integrated airflow path through the integrated airflow path and to a second opening of the integrated airflow path, a circuit board mechanically coupled to the integrated airflow path such that at least a portion of the circuit board resides within the partially closed volume, and a connector electrically and mechanically coupled to the circuit board and configured to electrically and mechanically couple a device received in the connector to the circuit board.