CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

A connection structural body includes a first connection terminal, a second connection terminal facing the first connection terminal, and a bonding member bonding the first connection terminal and the second connection terminal. The bonding member includes an intermetallic compound layer that is for...

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Bibliographische Detailangaben
1. Verfasser:	Aizawa, Mitsuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A connection structural body includes a first connection terminal, a second connection terminal facing the first connection terminal, and a bonding member bonding the first connection terminal and the second connection terminal. The bonding member includes an intermetallic compound layer that is formed by a roughened-surface metal film, structured by deposits of metal piled over one another such that a large number of pores are formed, and a solder layer that is disposed in the pores.