PACKAGING METHOD AND PACKAGE MEMBER

A packaging method includes: obtaining a carrier and processing a first pad on a side surface of the carrier; processing a second pad on a side surface of the first pad away from the carrier; obtaining a first sealing material, pressing the first sealing material with the second pad, the first pad,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JIANG, JING, SONG, GUANQIANG, XIAO, HAOYANG, GAO, CHENSHAN, LI, YUHONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A packaging method includes: obtaining a carrier and processing a first pad on a side surface of the carrier; processing a second pad on a side surface of the first pad away from the carrier; obtaining a first sealing material, pressing the first sealing material with the second pad, the first pad, and a side surface of the carrier on which the first pad is arranged to form a first sealing member; processing a chip pad on a side surface of each first pad away from the second pad; mounting a chip on at least one chip pad; obtaining a second sealing material, pressing the second sealing material with the chip, a side surface of the chip pad away from the second pad, and a side surface of the first sealing member near the first pad, to form a second sealing member.