SEMICONDUCTOR PACKAGE

A semiconductor package includes a substrate including a first redistribution member including a first surface and a second surface, and including a first redistribution layer, an interconnection chip below the second surface and including an interconnection circuit electrically connected to the fir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Yongkoon, Ko, Youngchan, Kim, Byungho
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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