SEMICONDUCTOR PACKAGE

A semiconductor package includes a substrate including a first redistribution member including a first surface and a second surface, and including a first redistribution layer, an interconnection chip below the second surface and including an interconnection circuit electrically connected to the first redistribution layer, a via structure around the interconnection chip and electrically connected to the first redistribution layer, an encapsulant between the second surface and the interconnection chip and the via structure, a first pillar extending through the encapsulant to electrically connect the first redistribution layer and the interconnection circuit, a second pillar extending through the encapsulant to electrically connect the first redistribution layer and the via structure, and connection bumps below the interconnection chip and the via structure, and first and second chip structures on the first surface of the first redistribution member and electrically connected to the first redistribution layer. The first pillar and the second pillar have different shapes.