SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A semiconductor package includes a redistribution substrate. A first semiconductor chip is disposed on the redistribution substrate. The first semiconductor chip includes a first semiconductor substrate, first through vias penetrating through the first semiconductor substrate, and a first bonding layer disposed on the first semiconductor substrate. The first bonding layer is electrically connected to the first through vias. A second semiconductor chip includes a second semiconductor substrate and a second bonding layer disposed on the second semiconductor substrate. The second bonding layer is bonded to the first bonding layer. A filling insulating film is disposed on the redistribution substrate. The filling insulating film covers the first semiconductor chip and the second semiconductor chip. An upper surface of the filling insulating film is disposed on a level above an upper surface of the first semiconductor chip and an upper surface of the second semiconductor chip.