HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embod...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided. |
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