PACKAGE HEATERS FOR COLD TEMPERATURE OPERATION AND METHOD

PACKAGE HEATERS FOR COLD TEMPERATURE OPERATION AND METHOD

A semiconductor package comprises two or more dies including at least one integrated circuit. The package can further include a heater element. The heater element can be configured to radiate heat, within one or more of a metal layer and a diffusion layer of at least one of the two or more dies of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Connolly, Kevin, Rawal, Chetan, Kondapuram, Ganesh, Anderson, Robert
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package comprises two or more dies including at least one integrated circuit. The package can further include a heater element. The heater element can be configured to radiate heat, within one or more of a metal layer and a diffusion layer of at least one of the two or more dies of the semiconductor package. The package can further include controller interface configured to receive a heater enablement signal to initiate or terminate operation of the heater element. Other systems, apparatuses and methods are described.