SILVER ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING ROUGH MATT SILVER

Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.

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Bibliographische Detailangaben
Hauptverfasser:	TING, Fai Lung, WU, Weigang
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.