CURABLE ORGANOPOLYSILOXANE COMPOSITION AND USE THEREFOR

Provided is a curable organopolysiloxane composition having favorable curing properties, maintaining a favorable pot life even as a single component composition and showing sharp and rapid curing reactivity triggered by ultraviolet light or other high energy beam irradiation and heating, and in which curing defect problems are less likely to occur even in light shielded portions where irradiation with a high energy beam such or the like is difficult. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond, (B) an organohydrogenpolysiloxane, (C) a first hydrosilylation catalyst that exhibits activity by irradiating with a high energy beam, and (D) a second hydrosilylation catalyst microencapsulated by a thermoplastic resin with a softening point within a temperature range of 50 to 200° C. In general, a hydrosilylation reaction inhibitor is substantially not required. A method of forming an organopolysiloxane cured product is also provided.