STACK-TYPE SEMICONDUCTOR PACKAGE

A semiconductor package includes a buffer die. One or more first semiconductor dies are stacked on the buffer die such that active surfaces face the buffer die. A second semiconductor die is stacked on the first semiconductor dies. The second semiconductor die includes a first layer and a second layer disposed thereon. The first layer includes a first semiconductor substrate. First memory blocks are disposed on the first semiconductor substrate. A first penetration electrode vertically penetrates the first semiconductor substrate and is connected to the first memory blocks. The second layer includes a second semiconductor substrate and computing blocks disposed on the second semiconductor substrate. The first and second layers have active surfaces in contact with each other. The first memory block aid the computing block have first and second pads, respectively, in contact with each other.