ELECTRONIC CIRCUIT ASSEMBLIES, METHODS OF MANUFACTURING THE SAME, AND MODULES

An electronic circuit assembly comprises: a first electronic circuit module; a second electronic circuit module; and a quantity of anisotropic conductive adhesive, ACA, comprising a plurality of electrically conductive particles and an electrically non-conductive adhesive, arranged to bond the first electronic circuit module to the second electronic circuit module. The first electronic circuit module comprises a first surface and a first pair of electrical contacts each provided on said first surface, the second electronic circuit module comprises a second surface and a second pair of electrical contacts each provided on said second surface, said first surface is arranged to face said second surface, said first pair of electrical contacts is aligned with said second pair of electrical contacts such that a first electrical contact of the first pair opposes a first electrical contact of the second pair and a second electrical contact of the first pair opposes a second electrical contact of the second pair, said quantity of ACA occupies a volume between the first and second surfaces, and conductive particles of the ACA provide a first electrical connection between the first electrical contacts of the first and second pairs, and a second electrical connection between the second electrical contacts of the first and second pairs. The first electronic circuit module further comprises at least one member provided on and protruding from said first surface and arranged between the first pair of electrical contacts, and at least one channel provided through a said member or defined between a plurality of said members, each said channel providing a flow channel, in a direction parallel to the first surface, for at least said non-conductive adhesive during manufacture of the assembly.