INTEGRATED DEVICE DIE WITH THERMAL CONNECTION

An integrated device die is disclosed. The integrated device die can include a substrate having a first side and a second side opposite the first side, a heat generating electronic component disposed over the first side of the substrate, a dielectric layer disposed such that the heat generating elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kothari, Nakul, Blin, Guillaume Alexandre, Wallis, Leslie Paul
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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