INTEGRATED DEVICE DIE WITH THERMAL CONNECTION

An integrated device die is disclosed. The integrated device die can include a substrate having a first side and a second side opposite the first side, a heat generating electronic component disposed over the first side of the substrate, a dielectric layer disposed such that the heat generating electronic component is positioned at least partially between the substrate and the dielectric layer. A surface of the dielectric layer that faces away from the substrate includes a terminal that is electrically connected to the heat generating electronic component and is laterally offset from the heat generating electronic component. The thermally conductive structure is positioned between the substrate and the terminal. The substrate and the thermally conductive structure at least partially define a thermal pathway between the heat generating electronic component and the terminal.