ETCHING SYSTEM FOR FABRICATING SEMICONDUCTOR DEVICE STRUCTURE

The present application discloses an etching system. The etching system includes an etch module executing a first etching recipe on a first wafer to turn a first wafer state of the first wafer to a second wafer state; a first measurement module collecting the second wafer state of the first wafer to generate a first set of data; and an artificial intelligence module coupled to the first measurement module and the etch module, analyzing the first set of data and update the first etching recipe to a second etching recipe when the first set of data is not within a predetermined range. The artificial intelligence module is configured for generating the second etching recipe taking into consideration at least one of an etching rate of the second wafer, a rate of rotation of the second wafer, and a tilt angle of the second wafer.