LASER PROCESSING APPARATUS

A controller includes a spot shape storing section that stores the shape of a spot of a laser beam with which a wafer held by a chuck table is irradiated, and a processing shape storing section that stores X-coordinates and Y-coordinates on a processing shape to be formed in the wafer. When the wafer is irradiated with the spot of the laser beam, an X-axis optical scanner and a Y-axis optical scanner are controlled on the basis of the shape of the spot, and the X-coordinates and Y-coordinates on the processing shape and irradiation with the laser beam is executed so that that the contour of the shape of the spot is positioned to an X-coordinate and Y-coordinate on the processing shape, and that a tangent line to the spot and a tangent line to the processing shape at the X-coordinate and Y-coordinate correspond with each other.