LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM

LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM

Laser processing head (10) includes a bend mirror that bends a second laser beam in a direction intersecting a first laser beam; a dichroic mirror that transmits most of the first laser beam and reflects most of the second laser beam; a workpiece-side condensing lens that condenses the most of the e...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKAHASHI, WATARU, OGUCHI, HISAYUKI
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:Laser processing head (10) includes a bend mirror that bends a second laser beam in a direction intersecting a first laser beam; a dichroic mirror that transmits most of the first laser beam and reflects most of the second laser beam; a workpiece-side condensing lens that condenses the most of the each laser beam to irradiate the workpiece; an image sensor that receives a rest of the first laser beam reflected by the dichroic mirror and a rest of the second laser beam transmitted through the dichroic mirror; a detection-side condensing lens that condenses the rest of the each laser beam to irradiate the image sensor; and an adjuster that adjusts a workpiece-side condensing state on an image plane on a workpiece side. The image sensor detects a detection-side condensing state on an image plane on an image sensor side. The workpiece-side condensing state is adjusted by the adjuster based on the detection-side condensing state.