PRINTED CIRCUIT BOARD

A printed circuit board includes a first insulating layer, a first pad embedded in one surface side of the first insulating layer and having one surface exposed from one surface of the first insulating layer, and a first surface treatment layer disposed on the exposed one surface of the first pad. A...

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Bibliographische Detailangaben
1. Verfasser:	LEE, Kye Hwan
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board includes a first insulating layer, a first pad embedded in one surface side of the first insulating layer and having one surface exposed from one surface of the first insulating layer, and a first surface treatment layer disposed on the exposed one surface of the first pad. A boundary surface between the first pad and the first surface treatment layer is substantially coplanar with the one surface of the first insulating layer.