SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS, EQUIPMENT, AND SUBSTRATE

A semiconductor apparatus includes a semiconductor layer, a wiring layer or a plurality of wiring layers, and a first heat dissipation layer. The semiconductor layer has a first surface and a second surface and includes, between the first surface and the second surface, a semiconductor element and a protection circuit. The wiring layer(s) is disposed at a first-surface side and electrically connected to the protection circuit. The first-surface side is a side where the first surface is located. The first heat dissipation layer is disposed between the wiring layer and the semiconductor layer or between a wiring layer closest to the semiconductor layer, among the wiring layers, and the semiconductor layer, and not electrically connected to the protection circuit. In a plan view taken at the first-surface side, the first heat dissipation layer is disposed at a position of overlapping with at least a part of the protection circuit.